Principal or Sr. Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design - Military Veterans

at Northrop Grumman

Linthicum Heights, Maryland

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is leading the development of the next generation of high-performance computing. Superconducting electronics forms the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Recipropcal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds. The Advanced Capabilities division seeks experienced test engineers to develop these technologies into high-performance computing systems. You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality.

Responsibilities:

Lead and/or contribute directly, working on design and analysis of signal integrity and electromagnetic effects in highly complex high frequency, high dynamic range mixed signal systems in a very collaborative and innovative research and development environment.

Perform analytical studies of electronic systems (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, etc.) to support design tradeoffs.

Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI) for packaging parasitic estimation, associated interconnect, PCBA and filters. All design, testing and verification efforts ensure simulated and measured results meet desired design targets, and continually improve simulation-measurement correlation.

Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art. Create new design strategies where possible to support functional requirements while meeting SI, PI and EM goals. Deep understanding of RF/EMC measurement and analysis (s-parameters, eigenmodes, TDR, FFT, IF, etc.) Work closely with other domain experts performing related functional analyses (e.g. Mechanical design & analysis, circuit design & test, thermal analysis, etc.).

Willingness to continually expand the knowledge base of yourself and the team (e.g. examine new research, relevant papers, seek applicable methodologies in adjacent applications, etc.). Coordinate related technical team activities.
Present details of work to colleagues during design reviews. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed (e.g. for reports).

This position can be filled at the Principal level OR Sr. Principal level. Qualifications for both are listed below:

Basic Qualifications for Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:
  • Bachelors degree with 5 plus years experience from any of a wide range of CAD/simulation(e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity) in support of design and analysis; or 3 years of the same with a Masters' degree; or 0 years with a PhD.
  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques.
  • Knowledge of fundamental electrical engineering and circuit design principles.
  • Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
  • Ability to obtain and maintain a TS/SCI Security Clearance. US Citizenship is a requirement for this position.
  • Ability to work well in a team and independently, to adapt to changing priorities and requirements, ask questions, make recommendations, document current processes and propose value add changes.
Preferred Qualifications:
  • Ansys HFSS modeling for RF packaging effects is a plus.
  • Experience with spectrum and network analyzer techniques for EMC measurements is a plus.
  • Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) is a plus.
  • Familiarity with cryogenic test stands, superconductivity, mechanical CTE, is a plus.
  • Active TS/SCI with Poly Security Clearance is a plus. (US Citizenship is a requirement for this position)
Basic Qualifications for Sr. Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:
  • Bachelors degree with 9 plus years experience with a wide range of CAD/simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity); 7 years with a Masters' degree; 4 years with a PhD.
  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.
  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques.
  • Knowledge of fundamental electrical engineering and circuit design principles.
  • Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
  • Ability to obtain and maintain a TS/SCI with Poly Security Clearance. US Citizenship is a requirement for this position.
  • Ability to work well in a team and independently, to adapt to changing priorities and requirements, ask questions, make recommendations, document current processes and propose value add changes.
Preferred Qualifications:
  • Ansys HFSS modeling for RF packaging effects is a plus.
  • Experience with spectrum and network analyzer techniques for EMC measurements is a plus.
  • Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) is a plus.
  • Familiarity with cryogenic test stands, superconductivity, mechanical CTE, is a plus.
  • Active TS/SCI with Poly Security Clearance is a plus. (US Citizenship is a requirement for this position)
Salary Range: $96,900 USD - $145,300 USD
Salary Range 2: $120,000 USD - $180,000 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/ .

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.

Linthicum Heights, Maryland

Become part of a team at the forefront of technology and the frontline of defense when you start Defining Possible with Northrop Grumman. We currently have opportunities across the world for those ready to solve our toughest challenges on land, sea, air, space and cyberspace.

With Northrop Grumman, you’ll be joining a culture where your voice is heard and contributions are valued. Launch your career and join the over 17,000 veterans pushing past possible every day to create and deliver the most advanced systems that connect and protect our world.  Northrop Grumman careers and internships are as varied as your interests, with a lifetime of potential that will allow you to work together with people from many backgrounds, personal passions and disciplines.

© 2020 Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. U.S. Citizenship is required for most positions. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO.

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