Dallas, Texas

Magnetic Sensors R&D Engineering Lead 

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

*Job Description

 

Kilby Labs, TI’s central R&D organization, is looking for a qualified candidate to champion a team working on the cutting edge magnetic current and position sensors development with ownership over competitive analysis, solution architecture, sensor design and packaging.   Kilby Labs represents a research organization within TI chartered to define new, innovate and valuable IP in collaboration with business units and customers. This research organization is afforded the freedom to take on more risky and disruptive IP development than typical product lines. Kilby engineers must have the ability to approach new and/or existing problems from a different perspective in a way that results in unique, highly disruptive and protectable solutions. Kilby engineers are required to be self-motivated, critical thinkers, clear communicators, and be able to influence both technical and business leaders all within in team environments.

As a magnetics sensor R&D engineer for TI’s Kilby Labs, you will be responsible for proposing and validating new ideas for current and position sensors for TI’s magnetic and current sensor portfolio of products based on inputs from customers and internal business and marketing teams.  This includes proposing topologies to best account for product performance, cost, form factor, and reliability, taking into account co-design between mechanical and electrical/magnetic domains, and working with wafer process, package, and circuit design teams to execute on validating the topologies. 

 

Experience with magnetic sensing (Hall, AMR, GMR, TMR), current sensing, isolation, and a broad understanding of applications leveraging magnetics are important to this role.  Wafer process and assembly/packaging understanding are also highly beneficial to this role.  Exceptional candidates will demonstrate the ability to understand problems, propose and model unique solutions and evaluate their solutions through simulation and hardware prototypes. A fundamental knowledge of semiconductor and packaging structures, processes, and magnetics is a must.  

 

Specific responsibilities will include:
• Collaborate with IC designers, package, and process technologists, internal and external foundries and subcons, to implement and integrate system constraints into the co-design of the product feasibility vehicles.

•  Define sensor and package topology to account for product needs including performance, cost, and form factor.
• Build and verify experimental prototypes to verify performance versus requirements

• Drive process, package, or circuit innovation to enable product roadmaps

This position can be located in Dallas, TX, Manchester, NH, Santa Clara, CA, Munich Germany, or Tokyo Japan


To be considered for this position, please apply to this requisition.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity, or age.


Minimum Qualifications:

-Bachelors in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. Masters or Ph.D. preferred

- 10+ years relevant work experience

-Possess a thorough understanding of the physics of magnetic devices as well as the analysis, materials, construction, design and operation of magnetic sensors

-Thorough knowledge of co-design and interaction between device, package, and system

-Thorough knowledge of magnetic devices (hall, AMR, GMR, TMR)

-Thorough knowledge of wafer and package assembly processes

-Thorough knowledge of isolation requirements for packaging

-Proven track record of successfully demonstrating the design of new magnetic sensors

 

To be considered for this position, please apply to this requisition
 


Successful applicants for this position must be fully vaccinated against COVID-19 as a condition of employment. Vaccine verification will be required by October 29, 2021 or your start date, whichever is later, unless an exemption has been approved by TI as a medical or religious accommodation.

If you are interested in this position, please apply to this requisition.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. See Job Description

Dallas, Texas

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story.

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