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All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.

Job Description:

Position Overview:

As a Wafer Fab Process Engineer, you will develop, improve and sustain wafer fab processes including dry etch, wet etch and thin film deposition processes for high volume photonic integrated device manufacturing. You will report directly to our Waferfab Sustaining Engineering Manager.

Responsibilities:

Developing, improving, and sustaining wafer fab processes including RIE/ICP dry etch, wet etch and thin film deposition processes for high volume photonic integrated circuit manufacturing.

Owning RIE/ICP and/or other processes and tools

Conducting data analysis, failure analysis, and yield improvement

Maintaining or defining process SOPs, providing instructions to operators for wafer processing

Maintaining or defining quality management standard including creating and reviewing SPC charts for robust quality control

Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner

Supporting equipment engineer in tool troubleshooting

Requirements:

5 years of hands-on wafer fabrication experience, preferably from a production environment

Direct experience in RIE/ICP, wet chemistry, or thin film deposition

Familiar with material & process characterization methods

Experience in using SPC and DOE

Strong problem solving, teamwork, and communication skills

Being able to work overtime when needed

Master's degree in Physics, Electrical/Chemical/Material/Device engineering or related fields. Bachelor's degree with extensive experience will be considered.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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